Lemansau Firmware vulnerabilities

3 known vulnerabilities in Lemansau Firmware from Qualcomm. 3 are rated high or critical, and 1 has been exploited in real attacks. Each entry lists the affected versions and the release that fixes it, where the vendor has published one.

Latest first

• 7.1 High severity

  Snapdragon: Reusing a Nonce, Key Pair in Encryption

  CVE-2026-21383Jul 6, 2026Qualcomm

  Cryptographic Issue when using a static initialization vector for AES-GCM key wrapping, which requires a unique value for each call to ensure security.

• 7.8 High severity

  Qualcomm Multiple Chipsets Memory Corruption Exploited

  CVE-2026-21385Mar 2, 2026QualcommEPSS 1.32%

  Memory corruption while using alignments for memory allocation.

• 7.8 High severity

  Snapdragon: Use After Free

  CVE-2025-47379Mar 2, 2026Qualcomm

  Memory Corruption when concurrent access to shared buffer occurs due to improper synchronization between assignment and deallocation of buffer resources.