Qualcomm Dragonwing X100 Accelerator Card Firmware vulnerabilities

2 known vulnerabilities in Qualcomm Dragonwing X100 Accelerator Card Firmware from Qualcomm. 2 are rated high or critical. Each entry lists the affected versions and the release that fixes it, where the vendor has published one.

Latest first

• 7.1 High severity

  Snapdragon: Improper Verification of Cryptographic Signature

  CVE-2026-25302Oct 6, 2026Qualcomm

  Cryptographic Issue when processing non-ELF partitions, authentication and signature checks are bypassed, allowing unsigned or corrupted images to be mounted and processed.

• 7.1 High severity

  Snapdragon: Reusing a Nonce, Key Pair in Encryption

  CVE-2026-21383Jul 6, 2026Qualcomm

  Cryptographic Issue when using a static initialization vector for AES-GCM key wrapping, which requires a unique value for each call to ensure security.